The Laser Microprocessing track focuses on how lasers are used at the microscale in electronics, energy, sensing, medical devices, and advanced manufacturing. Sessions will cover topics such as surface functionalization, high-precision drilling, and micro-welding of dissimilar materials. With contributions from both research and industry, the track offers a unique update on the state of the art in precision laser processing.
Session Search
* Program subject to change.
| Day | Session | Title | Keywords |
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| Tuesday | Process Optimization | Low Carbon Framework for Laser Cleaning Optimization |
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| Tuesday | Process Optimization | Realtime Detection of the Ablation Rate during Short and Ultrashort Pulsed Laser Processing |
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| Tuesday | Utrafast Laser Drilling | 5-Axis Ultrafast Laser Drilling with Burst Mode |
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| Tuesday | Utrafast Laser Drilling | Laser Micromachining Strategies for High Quality Perforation of Thin Titanium Foils to Produce Microporous Layers for PEM Electrolysis |
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| Tuesday | Utrafast Laser Drilling | Efficient Deep-Hole Drilling in Glass Substrates Using High-Intensity Ultrashort Pulse Laser |
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| Tuesday | Utrafast Laser Drilling | Optimized Helical Drilling of Deep High-Quality Microholes in Hard Materials Using Ultrafast Laser and Real-Time Depth Monitoring |
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| Wednesday | Glass and Ceramic Processing | Drilling of Through-Glass Vias (TGVs) Using Femtosecond GHz Burst Modes and Selective Laser Etching |
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| Wednesday | Glass and Ceramic Processing | Influence of Pulse Interval in Ablation Dynamics of Zirconia Ceramics During Ultrashort Laser Processing |
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| Wednesday | Glass and Ceramic Processing | Harnessing High-Power Picosecond Lasers: Revolutionising the Machining of Aluminium Nitride Ceramics |
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| Wednesday | Glass and Ceramic Processing | Back Reflection Analysis for Sensing Laser Drilling of Through-Glass Vias |
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