The Microprocessing track will consist of papers and talks featuring a wide spectrum of applications and innovative equipment for materials processing in microscales with a strong focus on processes with Short and Ultrashort Pulsed Lasers. The presentations will introduce the latest and greatest advancements in their respective fields, presented by world-leading companies and research organizations. This year we will have talks around the headlines of “Beam shaping”, “Glass”, “Surface processing” and “Drilling” between other topics.

Session Search

* Program subject to change.
Day Session Title Keywords
Tuesday Laser Ablation A Double-Scan Technique for Femtosecond Laser-Induced Nanobumps
  • Ultrafast Laser Surface Structuring
  • Surface Coloration
  • Double-Scan
  • Polarization
Tuesday Poster Gallery Analysis of Nanosecond-Scale Temperature Sensing Technology for Flat-Top Nanosecond Green Laser Annealing Process of Semiconductor Si Wafers
  • Nanosecond Laser
  • Nanosecond Green Laser
  • Si Wafer Laser Annealing
  • Nanosecond Temperature Sensing
  • Two Tone Nanosecond Temperature Sensing
Tuesday Poster Gallery Double-Pulse Laser Peening as a Surface Enhancement Technology
  • Laser Peening
  • Double Pulse
  • Laser Ablation
  • Surface Enhancement
Tuesday Poster Gallery Comparative Study of Single-Beam and Dual-Beam Laser Annealing for Dopant Activation Process
  • Dual-Beam Laser Annealing
  • Dopant Activation
  • Semiconductor
  • Silicon
Tuesday Poster Gallery Development of a Laser-based Process to Produce a Hermetically Sealed Contacting Interface for the Encapsulation of Temperature-sensitive Electronic Components
  • Laser
  • Gtms (Glass-To-Metal-Seal) Feedthrough
  • Ltcc Ceramic
  • Sealing
  • Encapsulation
Tuesday Poster Gallery Surface Characterization of Surface Nanostructures Fabricated by Femtosecond Laser Pulses in GHz Burst Mode
  • Ghz Burst Mode
  • Femtosecond Laser
  • Laser-Induced Periodic Surface Structures (Lipss)
  • Surface Functionalization
Tuesday Poster Gallery Comparing Novel Chip Singulation Techniques for Silicon Carbide
  • Silicon Carbide
  • Chip Singulation
  • Dicing Technologies
  • Laser Dicing
Tuesday Processing of Non-Metals II A Study on the Fabrication of Channels and the Bipolar Plate in CNT Composites Using a Nanosecond Pulse Laser
  • Fuel Cell
  • Bipolar Plate
  • Channel
  • Laser Processing
  • Nanosecond Pulsed Laser
Tuesday Processing of Non-Metals II Silicon Carbide Ablation With Ultrashort and Nanosecond Pulse Lasers
  • Silicon Carbide Ablation
  • Wafer Scribing And Dicing
  • Ultrashort Pulse Machining
  • Burst Processing
  • Nanosecond Pulse Machining
Tuesday Processing of Non-Metals II P-type Laser Doping of High-Purity Semi-Insulating 4H-SiC
  • P-Type Laser Doping
  • Silicon Carbide
  • Gallium
  • Boron
  • Refraction Index Modulation
Tuesday Processing of Non-Metals II Advanced Continuum Mechanics Simulation of Ultra-Short Pulse Laser Processing: Unraveling Ablation Mechanisms
  • Ultra-Short Lulse Laser Ablation
  • Ablation Mechanisms
  • Multiphysical Process Simulation
Wednesday Surface Functionalization II Enhancing Mechanical Properties of FDM 3D-Printed Parts with Ultrafast Laser Post-Processing
  • Ultrafast Lasers
  • Post-Processing
  • Additive Manufacturing
Wednesday Surface Functionalization II The Aging Effect on Surface Wettability After Ultrafast Laser Surface Structuring
  • Ultrafast Laser Surface Structuring
  • Surface Wettability
  • Aging
Wednesday Surface Functionalization II Coupling High-power Femtosecond Lasers and Beam Engineering for Industrial Application Challenges
  • Femtosecond Processing
  • High Power Femtosecond Lasers
  • Laser Texturing Of Large Surfaces
  • Femtosecond Ghz Bursts