Industrial-grade lasers for micromachining typically deliver pulse durations from about 200 fs to the picosecond range. A promising direction for advancement lies in the use of ultrashort pulses—sub-50 fs and down to few-cycle electric fields. Although proof-of-concept demonstrations in ablating transparent materials have already shown the potential of such ultrashort pulses, their benefits under conditions representative of real industrial applications remain largely unexplored, as does their potential to enable new types of material modifications. One step forward in improving micromachining consists on using ultrashort pulses in green and UV spectral ranges in order to further decrease the fluence thresholds while increasing the efficiency of the process. In this contribution, we report on generating the second harmonic with 80 fs pulse duration and 515 nm central wavelength. We systematically benchmark the fundamental and second-harmonic wavelengths at 80 fs by ablating transparent materials under various fluences and overlapping ratios. We find that processing fused silica at shorter pulses produces cleaner ablation and null collateral damage, even at very high fluences. More notably, processing with 80 fs green pulses yields halved fluence thresholds, and roughness reduced up to threefold within a particular region of the parameter space investigated.  We also fabricated high-quality cavities in fused silica and sapphire exhibiting null chipping and total absence of cracks, demonstrating the benefits of 50 fs pulses. To our knowledge, this is the first ablation study with <80 fs pulses at 515 nm generated from an industrial laser, with strong potential to enable next-generation industrial applications.