Pulse width and wavelength are two primary parameters affecting the suitability of a laser for a particular process. While initial energy coupling is wavelength driven, the temporal duration over which energy is applied quickly takes over in driving material removal. There are also important practical considerations related to both, such as how well the light can be focused—and remain in focus throughout a manufacturing task—and how robust the optics must be to avoid damaging them. While UV wavelengths are often beneficial for coupling energy to a wider set of materials, their ability to be focused smaller and with longer Rayleigh ranges is often a primary reason they are chosen. Regarding pulse width, the discussion is often coarsely granular: “nanosecond” vs. “ultrashort pulse” (pico- and femtosecond), with little attention paid to, for example, variations solely within the nanosecond regime. In this work, we explore material ablation with UV, single-digit ns pulses of industrial materials such as copper, silicon, and ceramic. Ablation rates and efficiencies are determined and compared to results with longer-ns UV lasers. Some noteworthy benefits of using burst output are revealed and quantified in the context of ablation efficiency and quality.  Processing results using single-pulse and burst output—and sometimes both—are shown for select industrial applications, with an emphasis on using temporal pulse tunability to meet demanding requirements for both throughput and quality.