The rapid evolution of electronic manufacturing has significantly increased the demand for efficient, precise, and scalable methods of printed circuit board (PCB) depaneling. As electronic devices continue to shrink in size while increasing in complexity, conventional mechanical separation techniques, such as routing, sawing, or punching, face inherent limitations, including tool wear, induced mechanical stress, debris generation, and compromised edge quality. These drawbacks can adversely affect component reliability and overall production efficiency, particularly in high-density and miniaturized assemblies.

As a result, laser-based depaneling technologies have gained considerable attention as a superior alternative due to their non-contact nature, high precision, and process flexibility. In particular, nanosecond (ns) pulsed laser sources operating at ultraviolet (UV) and green wavelengths have proven highly effective for PCB processing. Their shorter wavelengths enable stronger absorption in common PCB materials, leading to improved energy coupling and reduced heat-affected zones, which are essential for preserving material integrity.

Despite these advantages, achieving both high throughput and high processing quality remains a critical challenge, especially in industrial-scale manufacturing. In this work, we investigate high-throughput PCB depaneling using high-power UV and green ns laser sources operating in a burst-mode regime, specifically CAREX laser systems from BLOOM, delivering an average power of 160 W at green wavelength.

By optimizing burst parameters and analysing wavelength-dependent laser–material interactions, this study demonstrates improved cutting quality, reduced defects, and increased processing efficiency (>20mm/s at green wavelength).