Delamination between epoxy molding compounds (EMC) and copper leadframes is a critical failure mechanism in transfer-molded power modules, driven by thermomechanical stress. Rolled copper leadframes exhibit low surface roughness (Rz < 1.5 µm), limiting mechanical interlocking. Laser-induced surface structuring generates defined microtopographies that enhance adhesion. This study investigates the influence of laser-induced surface topographies on the thermomechanical delamination resistance of copper-epoxy interfaces. Preliminary investigations identify a roughness depth of Rz > 13 µm as the threshold for sufficient mechanical interlocking. Furthermore, the influence of surface coverage continuity on long-term reliability is evaluated.Three laser parameter sets are characterized using confocal 3D microscopy and compared with a reference process. Thermomechanical stability is assessed through soldering simulation, temperature cycling and heat-humidity tests, with delamination detected by scanning acoustic microscopy (SAM). The scanning strategy and line pitch are varied to investigate surface continuity, with coverage analyzed by scanning electron microscopy (SEM). The results show that laser structuring significantly improves thermal stability, increasing the delamination onset temperature from 240 °C in untreated leadframes to above 270 °C. Under cyclic loading, roughness alone proves insufficient. At a 0.045 mm pitch, no delamination occurs after 1000 thermal cycles, whereas delamination is detected after 465 cycles at a 0.1 mm pitch despite comparable roughness values. SEM analysis reveals that larger line pitches leave smooth regions between laser tracks that act as stress concentrators. These findings demonstrate that, beyond roughness, continuous surface coverage is crucial for delamination resistance.