Ultra-short pulse laser machining has emerged as a transformative technology across various industries, including medical device fabrication, electronics manufacturing, and precision glass machining. With each technological leap in laser power, new industrial applications have become feasible. Yet, as the industry approaches the threshold of high-power ultra-short pulse lasers, such as kilowatt-scale femtosecond systems for advanced R&D, the challenge shifts from merely harnessing this power to utilizing it intelligently without sacrificing machining quality. This is crucial as many users currently underutilize their systems' capabilities due to quality degradation at higher power settings.


This presentation addresses the utilization of Multi-Plane Light Conversion (MPLC) technology to optimize and expand the capabilities of ultra-short pulse laser systems. MPLC technology, notable for its entirely reflective design, ensures durability under high power and enhances process efficiency. Its mode-cleaning feature provides stable and robust beam shaping, which is less susceptible to laser and environmental variations, making it ideal for precision applications. Additionally, MPLC allows for intricate, high-quality beam shaping with an extensive depth of field, significantly easing integration into existing systems.


We will discuss the application of MPLC in combining beam shaping with splitting functionalities, highlighting the flexibility of this approach. Specific adaptations, such as adjustable beam division pitch, shape alterations, and rotation capabilities, will be showcased alongside their impact on the quality of micro-machining processes, particularly in surface texturing. The results underscore substantial improvements in both the quality and throughput of machining processes.