Pure copper has antimicrobial effect, and the development of pure copper coating technology for product surfaces is needed to prevent the spread of infections. To achieve high antimicrobial performance in coatings, it is essential to form a coating with high copper purity and minimal defects. In this study, we attempted to form a pure copper coating layer on a SS304 substrate using multi-beam directed energy deposition with blue diode lasers. In the coating layer formation process, multiple bead layers are overlapped to form a smooth surface and two different types of joining is conducted simultaneously: the similar material joining area with the remelted previous layer, and the dissimilar material joining area with the substrate. However, it was challenging to conduct this process for SS304 and pure copper, due to their significantly different thermal properties. Therefore, we varied the hatching distance to control the heat input to both joining areas and investigated the effect on the quality of the coating layer. The results showed that there is an optimal ratio of similar and dissimilar joining areas, at which a high-quality coating layer with few voids and low dilution is formed. Furthermore, antimicrobial tests showed that the pure copper coating layer formed in this study exhibited the antimicrobial performance equivalent to those of a pure copper plate.