Description

Electric mobility is undergoing a very rapid maturation process. While conventional vehicle design disciplines such as car body design are established, electromobility-specific disciplines are in the technological orientation and ramp-up phase.

In particular, the demand for components like batteries, e-motors and power electronics is growing continuously. There are two major material classes for these parts.

While aluminum alloys are used for housing applications, Copper alloys are especially utilized in conductive applications. Metal ceramic substates play a key role in electromobility and are used in every powertrain.

This paper offers an insight into the requirements of these parts as well as the innovative optics approach and the usage of a 515 nm wavelength laser. The material-specific challenges for the welding of the metal ceramic substrates are characterized. This analysis is conducted using CT-scans, micrographs, high-speed recordings in order to elaborate the fundamental laser-material-process interdependencies and the correlation between process and resulting quality in terms of conductivity and possible delamination and ceramic cracking.

Furthermore, high speed synchrotron recordings are conducted at the DESY and based on that a detailed evaluation of the laser and material interaction is conducted. This allows an explanation of the boundary conditions for laser welding of diverse metal ceramic substrates where the results for AMBs, DCBs and TFCBs are displayed and the interdependency between the process parameters and the processing results are elaborated.

Contributing Authors

  • Mauritz Möller
    TRUMPF Laser- und Systemtechnik GmbH
  • Andre Schwöbel
    Heraeus Deutschland GmbH & Co. KG
  • Oliver Bocksrocker
    TRUMPF Laser- und Systemtechnik GmbH
Mauritz Möller
TRUMPF Laser- und Systemtechnik GmbH
Track: Laser Materials Macroprocessing
Session: Welding and joining I
Day of Week: Monday
Date/Time:
Location: Stateballroom

Keywords

  • Copper
  • Laser Welding
  • Metal Ceramic Substrates
  • Power Electronics
  • Synchrotron