Description

Nowadays the technologies have to be more efficient, propose cutting edge processes, be more versatile while being environmental friendly. In this presentation, LASEA will introduce how the beam-shaping can improve the laser processes in particular in microfluidics, aeronautics, photovoltaic applications but also how the beam shaping is expected to increase the productivity of the machine in roller applications, roll-to-roll or batch-to-batch applications.

Different technologies can be used to shape the laser beam as spatial light modulator (SLM), double SLM, diffractive optical element (DOE) or as well multi-plane light conversion (MPLC) to produce versatile shaped beam (square, round, triangular, specific shape…) or multiple beams (line of beams, matrix of beams,…). The direct laser interference patterning (DLIP) is also a technology that shapes the beam enabling the production of multi-scales processes; micrometric and sub-micrometric structures. Consequently, LASEA will present these different possibilities, their expected impacts and how to integrate them in a laser machine to achieve high throughputs processes.

Moreover, the beam-shaping leading to multiple beams introduces many challenges in terms of laser machine design and laser development. Indeed, when the number of beams increases the laser has to be more powerful. During this presentation, LASEA will also expose the challenges to manage multiple beams and powerful laser source. Finally, the impacts and improvements expected by these types of technologies will also be present.

Contributing Authors

  • Anne Henrottin
    LASEA
  • Jérôme Patars
    LASEA
  • Marc Décultot
    LASEA
  • Audrey Champion
    LASEA
  • Céline Petit
    LASEA
  • Alexandre Vendramini
    LASEA
  • Antoine Defroidmont
    LASEA
  • David Bruneel
    LASEA
Anne Henrottin
LASEA
Track: Beam Shaping for Laser Materials Processing
Session: Improving Micro-Processing with Beam-Shaping
Day of Week: Wednesday
Date/Time:
Location: Salon 7

Keywords

  • Beam-Shaping
  • Femtosecond Laser Processing
  • High Productivity
  • Multiple Beams Processing