Description

The machining of transparent materials using ultrashort laser pulses has come up with versatile application possibilities ranging from high precision cutting, drilling, selective etching or welding during recent years. The basic concept denotes the focusing ultrashort pulses leading to high intensities that, triggered by nonlinear absorption, result confined energy transfer to the bulk material. Still, the tailored usage of laser power for a certain application requires not only process parameter optimization but temporal and spatial shaping of the laser intensity to allow for high throughput under industrial environment.

One example is the adhesive-free welding of glasses. Based on heat accumulation from pulse to pulse as well as high pulse overlap the material is melted locally which, after cooling and resolidification, generates a long term stable and gas dense joint. However, when using a Gaussian beam shape the focal tolerance as well as the maximal gap size that can be bridged is small. Within this talk we will demonstrate to overcome this limitation by adapted beam shape as well as temporal pulse energy management. Furthermore, besides of laser glass cutting, laser drilling of through glass vias with diameters in a broad range from several hundred nanometers to several hundred microns will be discussed.

Contributing Authors

  • Felix Zimmermann
    TRUMPF Laser- und Systemtechnik GmbH
  • Myriam Kaiser
    TRUMPF Laser- und Systemtechnik GmbH
  • Daniel Flamm
    TRUMPF Laser- und Systemtechnik GmbH
  • Jonas Kleiner
    TRUMPF Laser- und Systemtechnik GmbH
  • Tim Hesse
    TRUMPF Laser- und Systemtechnik GmbH
  • Heather George
    TRUMPF Inc. Laser Technology Center
  • David Havrilla
    TRUMPF Inc. Laser Technology Center
David Havrilla
TRUMPF Inc. Laser Technology Center
Track: Laser Materials Microprocessing
Session: Micro Session I
Day of Week: Monday
Date/Time:
Location:

Keywords

  • Cutting
  • Glass
  • Selective Etching
  • Ultrashort Laser Pulses
  • Welding