Laser Compression Bonder(LC Bonder) technology and its applications are introduced focusing on Cu paste sintering and other applications. Electric vehicle's power semiconductor chip needs higher frequency and power due to increase of battery pack inside vehicle in these days which needs bonding and battery operation in higher temperature. Typical solder paste bonding and Ag paste sintering are done around 220 to 250 degrees Celcius, But, its cost is too expensive to be applied actual industrial applications. So, much cheaper substitute material of Cu sintering paste was developed and tested using the LC Bonder which can be done at around 350 to 400 degrees Celcius for longer exposure time and medium laser power or 600 to 700 degrees Celcius for shorter time and higher power. At higher laser power, the temperature is increased so quickly and a good and high level of mechanical compression could make a nice sintering bonding results by making Cu nano particles's inter-distance reduced as much as possible in a very short time. During this compression using a fused silica glass, the laser beam with top-har beam mode is passed into the power semiconductor chip, Cu sintering paste and base plate.

These test results are introduced for quality and other relevant laser reflow technologies are also shown. Also, the power semiconductor technology for electric vehicle is also explained.