As big data and AI technologies continue to advance, the importance of semiconductor packaging technology is also growing. In packaging technology, interposers play a very important role. Currently, silicon interposers based on Through-Silicon Via (TSV) technology are widely used, however, they suffer from high manufacturing costs and signal noise issues. Glass has properties that make it suitable for interposers, such as low dielectric constant, high transparency, and adjustable coefficient of thermal expansion. As a result, the Glass core process, which compensates for the shortcomings of TSV technology, is attracting attention. Glass core technology has the advantages of higher dimensional stability, higher through-hole density, and faster speed signal by using a glass substrate. In this research, we used Selective Laser Etching (SLE) technology to generate holes. SLE has excellent precision and is attracting attention as an advantageous process for mass production. Through-Glass Via (TGV) with SLE process consists of two stages. The first process is ultrashort pulsed laser irradiation to create a laser local modification area, and the second process is chemical etching. This research will learn about the impact of changing the Donut Beam Diameter and machining the Hole. After designing the shape of the donut beam using Python, it is applied to the Spatial Light Modulator (SLM) to proceed with the TGV process. In this study, we changed the shape of the donut beam to adjust the hole diameter in the glass core process and confirmed that the method was effective.