A new coaxial laser wire bonding process is used to manufacture wire-based steel bridges. The wire bridges, which can absorb tensile forces, enable the manufacturing of weight optimized components. The process consists of setting a start point by laser wire bonding followed by the arc-shaped drawing of the wire and the final setting of an end point using the bonding process.
G4Si1 (SG3) steel wires with a diameter of 1.0 mm were bonded to a mild steel substrate S235JR (AISI1015). Various combinations of bonding parameters (focus position, laser power and laser process time) for the two bond points of the wire bridge were examined regarding process stability. A specific movement profile for the laser processing head with variable geometric parameters has been developed based on the bridge length and bridge symmetry. In addition, the geometric limits of the bridge were determined using the aspect ratio of bridge height to bridge length. The symmetrical and asymmetrical bridge shape was examined.
The influence of the bonding and geometric parameters on the maximum tensile force of the wire bridge was determined. By optimizing these parameters, a maximum tensile force of 909 N was achieved for a steel wire bridge with an asymmetrical shape.
Keywords
- Laser Wire Bonding
- Lightweight Design
- Tensile Testing
- Wire Bridge