Ultrafast lasers are currently the most powerful tools for manufacturing micrometric holes in glass, either through direct ablation or a two-step process involving chemical etching. Percussion drilling with ultrashort pulse lasers is a potentially simple and rapid technique for through-glass via (TGV) fabrication. However, it faces several challenges, such as the formation of a conical hole shape which leads to drilling saturation and low aspect ratios, as well as the risk of cracking and heat-affected zone (HAZ) formation at high pulse repetition rates. For these reasons, repetitive single-pulse operation is commonly considered an unsuitable method for manufacturing TGV substrates. In this study, we revisit the potential of repetitive single-pulse drilling - an often underrated technique - for high-quality deep-hole fabrication. By employing high-intensity femtosecond pulses with >200 uJ energy and optimized focusing conditions, we demonstrate complete penetration of 0.5 mm-thick Eagle XG glass and 1 mm-thick fused silica with minimal defects. We examine the influence of pulse duration, fluence, and repetition rate on processing speed. We explore strategies for controlling hole diameter and mitigating the formation of narrow openings caused by plasma escape at the rear side of the substrate. Additionally, we present a method to scale up the drilling rate using spatially distributed processing, enabled by an advanced pulse-on-demand available in the Jasper X1 femtosecond laser (Fluence Technology, Poland).